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  • High quality Wholesale price Mechanic lead-free solder paste BGA Solder paste ba-6352

Description

  • Model: ba-6352
  • Alloy: SAC305 (96.5%Sn) Lead-free
  • Powders Size: 20-28μm
  • Net: 33g(FULL)
  • size: 15.5*9*9.5cm
  • Certification: RoHS compliant
  • Shape: Small
  • Material: Halide-free

BAKU Wholesale BGA Solder Paste BK-6352:

1.Containing halogen good weldability 
2.High residutinal resistance 
3.Melting point lower temp 

 

Sort

Chemical composition (wt.%)

Sn

Bi

Ag

Pb

Fe

Al

Cd

Sn63Pb37

63±0.5

<0.001

<0.002

37

<0.02

<0.002

<0.003

 

 

 

 

 

 
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ba-6352 Series Precision Solder Paste
Designed for Precision Circuit Board Repair in Mobile Devices, High Tin Content for Shiny and Smooth Solder Joints

Product Overview:
The ba-6352 Series Precision Solder Paste is specifically developed for precision circuit board repair in mobile devices. With its high tin content, it ensures excellent soldering results, producing shiny and smooth solder joints. This solder paste is a reliable choice for achieving precise and high-quality repairs.

Product Features:

High tin content: The ba-6352 Series solder paste contains a high percentage of tin, resulting in superior soldering performance and reliable solder joints.
Shiny and smooth solder joints: This solder paste delivers exceptional wetting and flow characteristics, ensuring solder joints with a bright and smooth appearance.
Precision circuit board repair: It is optimized for intricate and delicate repairs on mobile device circuit boards, meeting the demanding requirements of precision soldering.
Additional features: Excellent adhesion, low voiding, high thermal stability, easy reflow process control.
Choose the ba-6352 Series Precision Solder Paste for precise and reliable circuit board repairs in mobile devices. With its high tin content and the ability to create shiny and smooth solder joints, it guarantees exceptional soldering results.

 
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