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Our 3D design allows for quick and accurate positioning, resulting in a more efficient repair process.
Don't settle for anything less than the best - try our 3D Soldering Net today!
3D Solder Masking Net - The Perfect Tool for Precise IC Repair and Soldering
Product Description:
The 3D Solder Masking Net is specifically designed to meet the demands of precise IC repair and soldering on circuit boards. Its unique 3D design enables quick and accurate positioning of ICs, securing them in place for efficient solder paste application. Crafted from ultra-thin stainless steel, this tool exhibits exceptional resistance to deformation, corrosion, and high temperatures. With laser-precise perforations, it perfectly aligns with IC soldering points. Whether you are a professional electronics engineer or an electronics enthusiast, the 3D Solder Masking Net is your ideal choice for achieving precise IC repair and soldering results.
Key Features:
Choose the 3D Solder Masking Net for reliable and accurate IC repair and soldering on circuit boards.
Product Name | 3D BGA reballing stencil | ||
Brand | BAKU | ||
Model |
A8: Contains all for iphone 6/6S plus models all need to tin the IC and CPU model. |
A9: Contains all for iphone 6S/6S plus models all need to tin the IC and CPU model . |
A10:Contains all for iphone 7/7 plus models all need to tin the IC and CPU model. |
Applicable Scope | Big audio U0900 | Big audio U3500 | Large power U1801 |
Baseband U_BB_RF | Baseband U_BB_RF | Intel baseband BB_RF | |
Large power supply U1202 | Large power supply U2000 | Gaumai base with BB_RF | |
Large radio frequency U_WTR_RF |
NPC U3501_RF | NFC NFC_RF | |
Small radio frequency U_WFR_RF |
Small audio U3700 | Big audio U3101 | |
Baseband power supply U_PMICRF |
USB management U4500 |
Baseband power supply XCVR1_RF |
|
Sensing IC U2201 |
Baseband power supply U_WTR_RF |
RF IC XCVRO_RF | |
Black touch U1801 NFC U5301_RF |
RF IC U3700 | BCM477341 | |
Small audio U1601 | CPU lower U0600 | CPU under the UO700 | |
CPU Lower U0201 | CPU upper layer U0600 | CPU upper layer U0700 | |
CPU upper layer U0201 | WIFI U5200_RF | WIFI WLAN_RF | |
WIFI U5201_RF | Charging IC U2300 | Charging IC U2101 | |
USB management U1700 | 20 # Universal U4000 | 20 # General U3703 | |
20 feet U5302_RF | Hard disk U1500 | Light control | |
White touch U2401 | Small audio U3301 | ||
Charging IC U1401 | USB management U4001 | ||
Hard disk U0604 | Hard disk U1701 | ||
Material | High-quality steel, anti-corrosion, high temperature | ||
Net Weight | 10g / pieces | ||
Product Size | 85 X 69 X 1 MM | ||
Gross Weight | 17g / piece | ||
With Packaging Size | 115 X 85 X 2 MM | ||
Features | accuratea lignment,super high quality,stepped groove,easy to use | ||
Package | 1. Double-sided protective film, scratch, to ensure that the original authentic original. | ||
2. Exquisite color box packaging, double protection. | |||
Benefits | 1. Stepped groove design enables stencil to align with tinning position of IC rapidly | ||
2. The square holes design makes it easier to take out the formed solder balls. | |||
3. This 3D stencil is easy to use no matter you are a new or expert. | |||
4. High success rate of planting tin,the solder balls can be formed once after you are proficient. | |||
5. This 3D planting stencil is thicer than ordinary stencils in the market. less tendency of defor mation makes its using life be longer. |
FAQ
1.What’s the MOQ?
A:Generally according to the requirements of customers, no matter how many we can accept.
2.Do you test all goods before delivery?
A:We have the stric QC process and offer you the videos of all step.
3. If any question when I got the product, how to solve it?
A:The product have warranty and we will offer you the online or video technical support.
4. Do you accept OEM order? (Can I make in my brand or any sticker? )
A:Yes, MOQ is 3000 piece.
5. How long can I get the product ?
A:if less than 10 pieces, it will be about 7 days
6.What kinds of payment do you accept?
A:T/T,Western Union, Paypal, credit card and trade assurance on Alibaba.