BAKU ba-230 Lead Free Soldering Flux

Lead-free and halogen-free: The ba-230 soldering flux is free from lead and halogens, meeting environmental standards and regulations.
No-clean formula: This flux leaves behind minimal residue, saving time and effort by eliminating the need for post-solder cleaning.
Protection for circuit boards and repair personnel: With low toxicity and reduced emissions, it provides protection for both circuit boards and repair personnel during soldering operations.
High impedance: The ba-230 flux ensures high electrical impedance, contributing to reliable performance and reducing the risk of electrical issues.
Superior wetting characteristics: It exhibits excellent wetting properties, allowing for uniform and efficient solder flow, resulting in robust and visually appealing solder joints.
For precision circuit board repair and soldering tasks, choose ba-230 Lead-Free Soldering Flux. With its lead-free and halogen-free composition, no-clean formula, high impedance, and superior wetting characteristics, it ensures safe and dependable soldering results.

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ba-230 Lead-Free Soldering Flux

Designed for Precision Circuit Board Repair and Soldering, Lead-Free and Halogen-Free,
No-Clean Formula, Protects Circuit Boards and Repair Personnel, High Impedance, Superior Wetting Characteristics.

Product Overview:

1. ba-230 Lead-Free Soldering Flux is specifically formulated for precision circuit board repair and soldering purposes.

2. Its lead-free and halogen-free composition provides a safe alternative while safeguarding circuit boards and repair personnel. This flux features a no-clean formula, eliminating the need for additional cleaning steps.

3. It offers high impedance and superior wetting characteristics, ensuring reliable and high quality soldering outcomes.

4. This environmentally-friendly solder paste is lead-free and halogen-free, ensuring no damage to the mainboard or repair personnel.

5. With RoHs environmental testing reports, it’s a trusted and reliable choice for any repair professional looking to increase efficiency. Get yours today!

Application

Dedicated to cellphone BGA-lC chip repairand for PCB/BGA/PGA/SMD repair also.

Model	ba-230
Branford Military Standard	Mil-f- 14256-d
PH Value	-6.6
CI	= 0
The Best Storage Temperature	5-10 °C in room temperature
Application	For mobile phone repa
Dimension	3.8312.2 / Piece
Weight	0.047KG / Piece (FULL)

BAKU ba-230 Lead Free Soldering Flux

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