BA 6352 BGA Solder Paste

• Containing halogen good weldability.
• High residutinal resistance.
• Melting point lower temp.

Product Features:

• High tin content: The ba-6352 Series solder paste contains a high percentage of tin, resulting in superior soldering performance and reliable solder joints.
• Shiny and smooth solder joints: This solder paste delivers exceptional wetting and flow characteristics, ensuring solder joints with a bright and smooth appearance.
• Precision circuit board repair: It is optimized for intricate and delicate repairs on mobile device circuit boards, meeting the demanding requirements of precision soldering.
• Additional features: Excellent adhesion, low voiding, high thermal stability, easy reflow process control.
• Choose the ba-6352 Series Precision Solder Paste for precise and reliable circuit board repairs in mobile devices.
• With its high tin content and the ability to create shiny and smooth solder joints, it guarantees exceptional soldering results.