BA 6351 BGA Solder Paste

Should be stored in a refrigerator upon recepit at 0-10°C (32-50°F).
permit paste to reach room temperature prior to opening, this will prevent condensations moisture on the solder paste.
Low “deposit to deposit” variation drives maximisation of first pass print and reflow yields.
High print deposit volumes and low volume variability down to 12mil (0.3mm) circle feature sizes.

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Model: ba-6351
Alloy: 63Sn/37Pb
Powders Size: 20-28μm
Net: 33g (FULL)
Colour: Translucent and Gray
Shape: Small
Quality: Excellent
Package Size: 152*113*93mm

Model	BK-6351
Net	33g
Alloy	sn63%/Pb37%
Purity	High
Quality	Excellent
Package Size	15211393mm
Microns	25-45um
Certification	RoHS

BA 6351 BGA Solder Paste

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