BGA Solder is a common form of electronic component package, which is widely used in modern electronic equipment. Due to its high welding temperature requirements.
It is usually necessary to use a high melting point of the tin slurry for welding. Because of its high melting point, the tin paste with a melting point of 158℃.
Is suitable for welding of BGA packages, which can ensure that the welding process will not be caused by too low temperature and welding failure 12.
In addition, choosing the right solder paste is crucial to the welding effect. The selection of tin paste needs to consider its melting point, composition, environmental protection and other factors. For example, high temperature tin paste is suitable for applications requiring higher welding temperatures.
While low temperature tin paste is suitable for temperature-sensitive components. In terms of environmental protection, lead-free tin paste has gradually become the mainstream choice because it is less harmful to the human body.
| Model | ba-5055 |
| Melting Point | 158°C |
| Bottle Color | White |
| Weight | 35g |
| Microns | 35~45um |
| MOQ | 120pcs |
| Temperature of Using | 160~170 |
| Certifcation | RoHS |
| Usage | Used for LED materials that are not resistant to high temperatures, not recommended for general products |
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