Solder paste is a no-clean solder paste designed for use in today’s SMT production process. It is made of lead-free alloy with little oxidation and inactive solder paste. The viscosity can meet the printing and spot coating process, and the application range is very wide.
1. Adapt to various electronic circuit board assembly industry of various processes of lead-free welding.
2. Suitable for lead-free tinning or welding of various components.
3. Also suitable for a variety of special process welding.
4. At the same time, it can also be deployed according to the actual production situation of customers to meet the customer’s production of lead-free solder paste.
Model | ba-5054 |
Melting Point | 220°C |
Bottle Color | Black |
Weight | 35g |
Microns | 35~45um |
Temperature of Using | 230-240℃ |
MOQ | 120pcs |
Certifcation | RoHS |
Usage | Used for products with SMT technology orhigh temperature resistance |