ba 5053 185℃ BGA Paste
ba 5053 185℃ BGA Paste
ba 5053 185℃ BGA Paste
ba 5053 185℃ BGA Paste
ba 5053 185℃ BGA Paste
ba 5053 185℃ BGA Paste

ba 5053 185℃ BGA Paste

  • Lead-free environmental protection: Generally speaking, the tin slurry of 185 ° C is lead-free, which meets the environmental requirements and helps to reduce the pollution of the environment.
  • Heat resistance: 185℃ tin paste has good heat resistance, can maintain stability in a certain temperature range, to ensure the quality of welding.
  • Wide range of application: 185℃ tin paste is suitable for welding of various electronic components, such as integrated circuits, capacitors, resistors, etc., with a wide range of applications.
  • In general, the 185℃ tin paste has the characteristics of low melting point, good welding performance, environmental protection, lead-free, good heat resistance, etc., which is suitable for welding electronic components with high welding temperature requirements.
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1. ba 5053 185℃ BGA paste is a common welding material, mainly used for welding electronic components.

2. Low melting point: The BGA tin paste of 185℃ has a relatively low melting point, which is suitable for electronic components sensitive to welding temperature, and can effectively avoid damage to components due to high temperature.

3. Good welding performance: 185℃ tin paste has good welding performance, can provide good wettability in the welding process, to ensure the quality of welding.

Model ba-5053
Melting Point 183°C
Bottle Color Green
Weight 35g
Microns 25~28um
MOQ 120pcs
Temperature of using 190-200℃
Certifcation RoHS
Usage Suitable for basic PCB componentmaintenance, commonly used

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