1. ba 5053 185℃ BGA paste is a common welding material, mainly used for welding electronic components.
2. Low melting point: The BGA tin paste of 185℃ has a relatively low melting point, which is suitable for electronic components sensitive to welding temperature, and can effectively avoid damage to components due to high temperature.
3. Good welding performance: 185℃ tin paste has good welding performance, can provide good wettability in the welding process, to ensure the quality of welding.
Model | ba-5053 |
Melting Point | 183°C |
Bottle Color | Green |
Weight | 35g |
Microns | 25~28um |
MOQ | 120pcs |
Temperature of using | 190-200℃ |
Certifcation | RoHS |
Usage | Suitable for basic PCB componentmaintenance, commonly used |