ba 5052 138℃ Lead-Free BGA Solder Paste

Environmentally Friendly: Complies with RoHS (Restriction of Hazardous Substances) standards, reducing harm to the environment and human health.
Low Melting Point: With a melting point of 138℃, it is suitable for soldering various electronic components, minimizing the risk of thermal damage.
Excellent Soldering Performance: Offers good wettability and flow characteristics, ensuring the reliability and strength of solder joints.
Wide Applicability: Can be widely used in the production and repair of electronic products such as mobile phones, computers, and home appliances.
Stability: Exhibits good stability in high-temperature and humid environments, making it suitable for long-term use.
Usage Recommendations.
Ensure that the soldering surfaces are clean before use to improve soldering effectiveness.
Choose the appropriate soldering temperature and time based on specific soldering requirements.

INQUIRY NOW

1. Are you tired of constantly searching for the right soldering materials to repair your mobile phone motherboard? Look no further than our mobile phone motherboard repair soldering materials kit!

2. Product Name: 138℃ Lead-Free Solder Paste.

3. Main Components: Lead-free alloy (such as tin, silver, copper, etc.).

4. Melting Point: 138℃.

Model	ba-5052
Melting Point	138°C
Bottle Color	White
Weight	35g
Microns	35~45um
MOQ	120pcs
Temperature of Using	160~170
Certifcation	RoHS
Type	LEAD-FREE SOLDER PASTE
Usage	Used for LED materials that are not resistant to high temperatures, not recommended for general products

ba 5052 138℃ Lead-Free BGA Solder Paste

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