Product Features:
1. Exclusive formulation: The ba-128 chip encapsulant and remover features a unique formula that guarantees optimal performance and compatibility with various types of chips.
2. Chip-safe: This product treats chips with care, preventing any harm or degradation during the encapsulation and removal processes.
3. No heat or additional equipment required: With ba-128, there’s no need for complicated heating procedures or additional machinery. It simplifies the chip repair process, saving time and effort.
4. Enables fast chip repairs: The efficient formulation and user-friendly application of ba-128 enable swift and effective chip repairs, minimizing downtime and maximizing productivity.
5. Opt for ba-128 Chip Encapsulant and Remover for your precision circuit board chip encapsulation and removal requirements. With its exclusive formulation, chip-safe properties, absence of heat or additional equipment needs, and ability to facilitate fast chip repairs, it ensures dependable and efficient results.
| Model |
ba-128 |
| Application |
Forframe separating and glue removing |
| Product Name |
Frame Adhesive Removing Liquid |
| Capacity |
30 ml (FULL) |
