3D Tin Planting Stencil

3D Solder Masking Net – The Perfect Tool for Precise IC Repair and Soldering

The 3D Solder Masking Net is specifically designed to meet the demands of precise IC repair and soldering on circuit boards.

Its unique 3D design enables quick and accurate positioning of ICs, securing them in place for efficient solder paste application.

Crafted from ultra-thin stainless steel, this tool exhibits exceptional resistance to deformation, corrosion, and high temperatures.

With laser-precise perforations, it perfectly aligns with IC soldering points.

Whether you are a professional electronics engineer or an electronics enthusiast, the 3D Solder Masking Net is your ideal choice for achieving precise IC repair and soldering results.

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Product Name	3D BGA reballing stencil
Brand	BAKU
Model	A8: Contains all for iphone 6/6S plus models all need to tin the IC and CPU model.	A9: Contains all for iphone 6S/6S plus models all need to tin the IC and CPU model .	A10:Contains all for iphone 7/7 plus models all need to tin the IC and CPU model.
Applicable Scope	Big audio U0900	Big audio U3500	Large power U1801
	Baseband U_BB_RF	Baseband U_BB_RF	Intel baseband BB_RF
	Large power supply U1202	Large power supply U2000	Gaumai base with BB_RF
	Large radio frequency U_WTR_RF	NPC U3501_RF	NFC NFC_RF
	Small radio frequency U_WFR_RF	Small audio U3700	Big audio U3101
	Baseband power supply U_PMICRF	USB management U4500	Baseband power supply XCVR1_RF
	Sensing IC U2201	Baseband power supply U_WTR_RF	RF IC XCVRO_RF
	Black touch U1801 NFC U5301_RF	RF IC U3700	BCM477341
	Small audio U1601	CPU lower U0600	CPU under the UO700
	CPU Lower U0201	CPU upper layer U0600	CPU upper layer U0700
	CPU upper layer U0201	WIFI U5200_RF	WIFI WLAN_RF
	WIFI U5201_RF	Charging IC U2300	Charging IC U2101
	USB management U1700	20 # Universal U4000	20 # General U3703
	20 feet U5302_RF	Hard disk U1500	Light control
	White touch U2401		Small audio U3301
	Charging IC U1401		USB management U4001
	Hard disk U0604		Hard disk U1701
Material	High-quality steel, anti-corrosion, high temperature
Net Weight	10g / pieces
Product Size	85 X 69 X 1 MM
Gross Weight	17g / piece
With Packaging Size	115 X 85 X 2 MM
Features	accuratea lignment,super high quality,stepped groove,easy to use
Package	1. Double-sided protective film, scratch, to ensure that the original authentic original.
Package	2. Exquisite color box packaging, double protection.
Benefits	1. Stepped groove design enables stencil to align with tinning position of IC rapidly
	2. The square holes design makes it easier to take out the formed solder balls.
	3. This 3D stencil is easy to use no matter you are a new or expert.
	4. High success rate of planting tin,the solder balls can be formed once after you are proficient.
	5. This 3D planting stencil is thicer than ordinary stencils in the market. less tendency of defor mation makes its using life be longer.

3D design for quick IC positioning and secure solder paste application
Ultra-thin stainless steel construction for durability and high-temperature resistance
Laser-precise perforations that perfectly match IC soldering points

Choose the 3D Solder Masking Net for reliable and accurate IC repair and soldering on circuit boards.

3D Tin Planting Stencil

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