Solder Tin Paste

Lead-Free Solder Paste is specifically designed for precision circuit board repair in mobile phones. It offers different solder paste configurations with varying melting points to ensure optimal soldering results.

ba 5052 138℃ Lead-Free BGA Solder Paste

ba 5052 138℃ Lead-Free BGA Solder Paste

Ensure that the soldering surfaces are clean before use to improve soldering effectiveness.

ba 5053 185℃ BGA Paste

ba 5053 185℃ BGA Paste

Lead-free environmental protection: Generally speaking, the tin slurry of 185 ° C is lead-free, which meets the environmental requirements and helps to reduce the pollution of the environment.

ba 5054 220℃ Solder Paste

ba 5054 220℃ Solder Paste

High Temperature Resistance: With a high melting point of 220℃, suitable for soldering in high-temperature environments to ensure solder joint stability.

ba 5055 158℃ BGA Solder Paste

ba 5055 158℃ BGA Solder Paste

No false welding / less residue / solder jointbright / climbing tin strong / good conductivity / no cleaning/non-corrosive PCB / oxidationresistance.

BA 6351 BGA Solder Paste

BA 6351 BGA Solder Paste

Should be stored in a refrigerator upon recepit at 0-10°C (32-50°F).

BA 6352 BGA Solder Paste

BA 6352 BGA Solder Paste

High tin content: The ba-6352 Series solder paste contains a high percentage of tin, resulting in superior soldering performance and reliable solder joints.

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