Lead-Free Solder Paste is specifically designed for precision circuit board repair in mobile phones. It offers different solder paste configurations with varying melting points to ensure optimal soldering results.
ba 5052 138℃ Lead-Free BGA Solder Paste
Ensure that the soldering surfaces are clean before use to improve soldering effectiveness.
Lead-free environmental protection: Generally speaking, the tin slurry of 185 ° C is lead-free, which meets the environmental requirements and helps to reduce the pollution of the environment.
High Temperature Resistance: With a high melting point of 220℃, suitable for soldering in high-temperature environments to ensure solder joint stability.
No false welding / less residue / solder jointbright / climbing tin strong / good conductivity / no cleaning/non-corrosive PCB / oxidationresistance.